{"event":{"title":"NEPCON JAPAN - February 17 - 19, 2027 at Tokyo","slug":"internepcon-japan-electronics-manufacturing-and-packaging-exhibition","summary":"NEPCON JAPAN is Asia's leading exhibition for electronics R&D, manufacturing and packaging technology. The 2027 Tokyo edition runs February 17-19 at Tokyo Big Sight, bringing together 8 specialised shows covering electronics manufacturing, packaging, testing and related technologies.","edition":"2027","schedule":{"startDate":"2027-02-17T12:00:00.000Z","endDate":"2027-02-19T12:00:00.000Z","dateDisplay":"February 17, 2027 — February 19, 2027","timeDisplay":"9:00 AM – 6:00 PM","display":"February 17, 2027 — February 19, 2027 · 9:00 AM – 6:00 PM Unverified","times":{"label":"9:00 AM – 6:00 PM","unverified":true,"unverifiedLabel":"Unverified"}},"venue":{"name":"Tokyo Big Sight","slug":"tokyo-big-sight-tokyo-jp","city":"Tokyo","stateProvince":"Tokyo"},"categories":["Electronics & ICT"],"tags":["electronics manufacturing","electronics-packaging","PCB","semiconductor","SMT","sensor","trade show","B2B trade show","tokyo","Tokyo Big Sight"],"websiteUrl":"https://www.nepconjapan.jp/tokyo/en-gb.html","verification":{"lastVerifiedAt":"2026-08-31T18:44:18.644Z","label":"Verified"},"url":"https://cantonshare.com/events/internepcon-japan-electronics-manufacturing-and-packaging-exhibition","eventStatus":"scheduled","eventAttendanceMode":"offline","frequency":"Annual","registrationUrl":"https://www.nepconjapan.jp/tokyo/en-gb/gbs/vis/preregi.html","contactEmail":"inw.jp@rxglobal.com","contactPhone":"+81-3-6739-4102","productsOnDisplay":["Printed circuit boards (PWB) and PCB assembly","IC and sensor packaging technologies","Electronic components and materials","Power devices and modules","Fine process technology","EMS/ODM manufacturing services","Electronics production and testing equipment"],"sourceUrl":"https://www.nepconjapan.jp/tokyo/en-gb.html"}}