BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//CantonShare//Event Tools//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:event-32985@cantonshare.com
DTSTAMP:20261022T020555Z
DTSTART;VALUE=DATE:20261027
DTEND;VALUE=DATE:20261030
SUMMARY:NEPCON ASIA 2026 – Platform for Electronic Manufacturing
DESCRIPTION:Shenzhen Semiconductor Packaging Technology Fair - trade exhibition.\n\nOfficial: https://www.nepconasia.com/en-gb.html\n\nhttps://cantonshare.com/events/shenzhen-semiconductor-packaging-technology-fair-44795
LOCATION:Shenzhen World Exhibition & Convention Center\, Shenzhen World Exhibition & Convention Center\, 1 Zhancheng Road\, Fuhai St\, Bao'an District\, Shenzhen\, Guangdong 518100\, China\, Shenzhen\, Guangdong\, Shenzhen
URL:https://cantonshare.com/events/shenzhen-semiconductor-packaging-technology-fair-44795
END:VEVENT
END:VCALENDAR