The International Technical Conference on Packaging and Integration of Electronic and Photonic Micro

InterPACK is the flagship international conference of the ASME Electronic and Photonic Packaging Division (EPPD) and the leading global forum for cutting-edge research, development, manufacturing, and applications in electronics packaging and heterogeneous integration. The program spans heterogeneous integration, servers of the future, edge and cloud computing, Internet of Things, additive and printed electronics, flexible and wearable electronics, photonics and optics, power electronics, energy conversion and storage, and autonomous, hybrid, and electric vehicles. Alongside technical paper presentations and exhibits, InterPACK 2026 will feature panel discussions, workshops, tutorials, keynote and technology talks from distinguished experts, and a joint poster session uniting industry, national labs, and academia.