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InterPACK 2026 Conference & Exhibition
October 26, 2026 — October 29, 2026 · 9:00 AM – 6:00 PM Unverified · San Diego Marriott Mission Valley—InterPACK 2026 is ASME's flagship conference on packaging and integration of electronic and photonic microsystems, held October 26–29, 2026 at San Diego Marriott Mission Valley in San Diego, California. Organized by the ASME Electronic and Photonic Packaging Division (EPPD), it brings together industry, academia, and national labs on heterogeneous integration, thermal management, power electronics, photonics, and flexible electronics.
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