SiP Conference China
SiP Conference China (co-located with Elexcon) focuses on system-in-package technology, advanced semiconductor packaging, and heterogeneous integration.
- Dates
- January 1, 2020
- Hours
- 9:00 AM – 6:00 PM Unverified
Please double-check the dates and location on the organizer website before attending.
About SiP Conference China
SiP Conference China, co-located with Elexcon at the Shenzhen World Exhibition & Convention Center, is a specialized conference and exhibition focused on system-in-package (SiP) technology, advanced semiconductor packaging, heterogeneous integration, 2.5D/3D packaging, chiplet architecture, and advanced interconnect solutions. SiP Conference connects semiconductor packaging engineers, IC designers, foundry partners, and electronic assembly companies.
What to Expect
- Latest product innovations and cutting-edge technologies
- Business matchmaking and professional networking sessions
- Industry seminars, conferences, and technical workshops
Venue & Schedule
Held at Shenzhen World Exhibition & Convention Center, Shenzhen, this exhibition provides a comprehensive platform for exploring new business opportunities.
Official Information
For more details, visit the official website.
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