Tags›#advanced packaging
2 events with this tag
cantonshare.com › events › sip-conference-china
January 1, 2020 · 9:00 AM – 6:00 PM Unverified · Shenzhen World Exhibition & Convention Center—SiP Conference China (co-located with Elexcon) focuses on system-in-package technology, advanced semiconductor packaging, and heterogeneous integration.
Electronics & ICT#trade show#semiconductor#System in Package#advanced packaging
cantonshare.com › events › semicon-japan
December 9, 2026 — December 11, 2026 · 9:00 AM – 6:00 PM · Tokyo Big Sight—Japan's premier semiconductor industry exhibition covering the full electronics manufacturing supply chain, from design and front-end process to packaging, test and advanced applications.
Electronics & ICT#semiconductor#electronics manufacturing#packaging#SEMI