2027
NEPCON JAPAN - February 17 - 19, 2027 at Tokyo
NEPCON JAPAN is Asia's leading exhibition for electronics R&D, manufacturing and packaging technology. The 2027 Tokyo edition runs February 17-19 at Tokyo Big Sight, bringing together 8 specialised shows covering electronics manufacturing, packaging, testing and related technologies.
- Dates
- February 17, 2027 — February 19, 2027
- Hours
- 9:00 AM – 6:00 PM Unverified
- Venue
- Tokyo Big Sight
- Frequency
- Annual
- Phone
- +81-3-6739-4102
- Contact
- [email protected]
Please double-check the dates and location on the organizer website before attending.
NEPCON JAPAN 2027
NEPCON JAPAN is Asia's leading exhibition for electronics R&D, manufacturing and packaging technology. The 2027 Tokyo edition will be held from February 17 (Wed) - 19 (Fri), 2027 at Tokyo Big Sight, Japan, 10:00-17:00 (JST).
About the show
Launched more than 40 years ago, NEPCON JAPAN has grown together with the Japanese and Asian electronics industries. Consisting of 8 specialised shows covering essential areas for electronics manufacturing and R&D, the event serves as Asia's leading one-stop venue for everyone involved in the electronics industry. The 2027 show expects approximately 1,800 exhibitors and 88,000 visitors.
8 specialised shows
- INTERNEPCON JAPAN
- ELECTROTEST JAPAN
- IC & SENSOR PACKAGING EXPO
- ELECTRONIC COMPONENTS & MATERIALS EXPO
- PWB EXPO
- FINE PROCESS TECHNOLOGY EXPO
- Power Device and Module Expo
- EMS & ODM EXPO
Products on display
- Printed circuit boards (PWB) and PCB assembly
- IC and sensor packaging technologies
- Electronic components and materials
- Power devices and modules
- Fine process technology
- EMS/ODM manufacturing services
- Electronics production and testing equipment
Visit
- Dates: February 17-19, 2027 (10:00-17:00 JST)
- Venue: Tokyo Big Sight, Tokyo, Japan
- Organiser: RX Japan GK
For more information, visit the official website: https://www.nepconjapan.jp/tokyo/en-gb.html
Products on Display
- Printed circuit boards (PWB) and PCB assembly
- IC and sensor packaging technologies
- Electronic components and materials
- Power devices and modules
- Fine process technology
- EMS/ODM manufacturing services
- Electronics production and testing equipment
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