Tags›#electronics-packaging
3 events with this tag
cantonshare.com › events › jpca-show-30569
June 10, 2026 — June 12, 2026 · 9:00 AM – 6:00 PM Unverified · Tokyo Big Sight (East Exhibition Halls)—jpcashow.com still documents JPCA Show 2026 (10–12 June, Tokyo Big Sight), marked finished. No official 2027 start and end days. Aggregator June 2027 dates are not used.
Electronics & ICTIndustrial Manufacturing#electronics-packaging#tokyo#Japan#B2B
cantonshare.com › events › interpack-44991
October 26, 2026 — October 29, 2026 · 9:00 AM – 6:00 PM Unverified · San Diego Marriott Mission Valley—InterPACK 2026 is ASME's flagship conference on packaging and integration of electronic and photonic microsystems, held October 26–29, 2026 at San Diego Marriott Mission Valley in San Diego, California. Organized by the ASME Electronic and Photonic Packaging Division (EPPD), it brings together industry, academia, and national labs on heterogeneous integration, thermal management, power electronics, photonics, and flexible electronics.
Electronics & ICTTechnologyScience & Research#trade show#exhibition#industry#conference
cantonshare.com › events › internepcon-japan-electronics-manufacturing-and-packaging-exhibition
February 17, 2027 — February 19, 2027 · 9:00 AM – 6:00 PM Unverified · Tokyo Big Sight—NEPCON JAPAN is Asia's leading exhibition for electronics R&D, manufacturing and packaging technology. The 2027 Tokyo edition runs February 17-19 at Tokyo Big Sight, bringing together 8 specialised shows covering electronics manufacturing, packaging, testing and related technologies.
Electronics & ICT#electronics manufacturing#electronics-packaging#PCB#semiconductor