InterPACK 2026 Conference & Exhibition
InterPACK 2026 is ASME's flagship conference on packaging and integration of electronic and photonic microsystems, held October 26–29, 2026 at San Diego Marriott Mission Valley in San Diego, California. Organized by the ASME Electronic and Photonic Packaging Division (EPPD), it brings together industry, academia, and national labs on heterogeneous integration, thermal management, power electronics, photonics, and flexible electronics.
- Dates
- October 26, 2026 — October 29, 2026
- Hours
- 9:00 AM – 6:00 PM Unverified
Please double-check the dates and location on the organizer website before attending.
InterPACK 2026
The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems
InterPACK is the leading global forum for research, development, manufacturing, and applications in electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD).
Dates & Venue
- Dates: October 26–29, 2026
- Venue: San Diego Marriott Mission Valley, 8757 Rio San Diego Drive, San Diego, CA 92108, USA
- Format: In-person
Focus Areas
Heterogeneous Integration; Data Center and Modular Edge Systems; Electronic Packaging for Extreme Environments; Power/RF Electronics and Photonics; Nanoscale Heat Transfer and Energy Storage; Flexible, Wearable, and Printed Electronics; Intelligent Modeling and Simulation; Micro/Nano Mechatronics and IoT applications.
Program
Technical paper presentations, exhibits, panel discussions, workshops, tutorials, keynotes, technology talks, and a joint poster session uniting industry, national labs, and academia.
Official Site
Note: This is ASME InterPACK (electronics/photonic packaging), not Messe Düsseldorf Interpack.
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